Advanced Ceramic Coatings and Interfaces V: Ceramic by Dongming Zhu, Hua-Tay Lin, Sanjay Mathur, Tatsuki Ohji

By Dongming Zhu, Hua-Tay Lin, Sanjay Mathur, Tatsuki Ohji

The current quantity comprises 16 contributed papers from the symposium, with subject matters together with complex coating processing, complicated coating for put on, corrosion, and oxidation resistance, and thermal and mechanical homes, highlighting the cutting-edge ceramic coatings applied sciences for numerous serious engineering purposes.

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Extra resources for Advanced Ceramic Coatings and Interfaces V: Ceramic Engineering and Science Proceedings, Volume 31

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These aspects will be considered in this paper as well as the influence of thermal strains produced during temperature changes. Initially, though, consideration will be given to the inherently mechanically unstable nature of a TBC system. e. W*h = G = G r (1) W* is the strain energy per unit volume of the oxide layer which, in the absence of mechanically imposed stresses, is the sum of the strain energy associated with oxide growth stresses and that due to differential strains during temperature changes9: W* : "σε+Εοχ(ΔΤ)(Δα))2(1-νοχ) (2) where a g is the growth stress within the oxide layer, E<,x is the Young's modulus of the oxide layer, vox its Poisson's ratio, ΔΤ the temperature change and Δα = (ctm-aox) is the difference in linear expansion coefficients between metal and oxide.

0. It is expected that local out-of-plane stresses even higher than those predicted above would develop at these regions. Whether or not these cracks can develop into a longer delamination that might permit final failure to occur by buckling, for example, depends on the consistency of bond coat surface roughness. This is because the strain energy associated with the continuity strains is localised. Any cracks that form will not have sufficient driving force to propagate unless adjacent regions of the bond coat have a similar roughness.

Substrate , BC and TC thicknesses, mechanical and thermal properties and thermal cycle were identical, cf. Tables 1 through 3). Interface profile height/half-period ratios used are • h/L =10/70,20/70,30/70 and 50/70. 0 have been computed. Table 3. 2-10"5 TC Substrate 213-10 The results are shown in Fig. 9. The general tendency is that thicker TGO gives larger G, Ki and Kn . The influence of profile height ratio h/L will be commented later, but it is worth noticing that for high h/L, Kj increases rapidly to an early maximum, from which it then rapidly decreases to 0 and becomes negative (actually meaning, of course, that the crack-opening loading is replaced by contact forces on the crack flanks).

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